國巨高壓0603/1608貼片電容基本參數(shù)
品牌 | YAGEO/國巨 | 型號 | 0603/1608 | 介質(zhì)材料 | 陶瓷(瓷介) |
應(yīng)用范圍 | 高壓 | 外形 | 方塊狀 | 功率特性 | 中功率 |
頻率特性 | 中頻 | 調(diào)節(jié)方式 | 微調(diào) | 引線類型 | 無引線 |
允許偏差 | ±5(%) | 耐壓值 | 250(V) | 等效串聯(lián)電阻(ESR) | 0(mΩ) |
標稱容量 | 0.47pF~10nF(uF) | 損耗 | 0 | 額定電壓 | 50(V) |
絕緣電阻 | 0(mΩ) | 溫度系數(shù) | 0 |
國巨高壓0603/1608 貼片電容 片容 貼片電容器關(guān)于檢測
TEST | TEST METHOD | PROCEDURE | REQUIREMENTS | |
Electrical Characterization | AEC-Q200 | 19 | Parametrically test per lot and sample size requirements, summary to show Min, Max, Mean and Standard deviation at room as well as Min and Max operating temperatures, | AC/C Class !:NP0: ±30 ppm/°C Class2:X7R: ±15% |
Class 1: NP0: -55 °C to +125 °C Normal temperature: 20 °C Class 2: X7R: -55 °C to +125 °C Normal temperature: 20 °C | ||||
Board Flex | AEC-Q200 | 21 | Part mounted on a 100 mm X 40 mm FR4 PCB board, which is 1.6 ±0,2 mm thick and has a layer-thickness 35 pm 土 10 pm, Part should be mounted using the following soldering reflow profile,Conditions: Class!: Bending 3 mm at a rate of 1 mm/s, radius jig 340 mm Class2: Bending 2 mm at a rate of 1 mm/s, radius jig 340 mm | No visible damageAC/C Class!: NP0: Within ±1% or 0, 5 pF, whichever is greater Class2: X7R: ±10% |
Terminal Strength | AEC-Q200 | 22 | With the component mounted on a PCB obtained with the device to be tested, apply a I7,7N (I,8Kg) force to the side of a device being tested, This force shall be applied for 60+1 seconds, Also the force shall be applied gradually as not to apply a shock to the component being tested, * Apply 2N force for 0402 size, | Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body, terminals and body/ terminal junction, Before, during and after the |
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