華新科0603/1608貼片電容基本參數(shù)
品牌 | WALSIN/華新科 | 型號 | 0603/1608 | 介質(zhì)材料 | 陶瓷(瓷介) |
應(yīng)用范圍 | 低壓 | 外形 | 方塊狀 | 功率特性 | 小功率 |
頻率特性 | 低頻 | 調(diào)節(jié)方式 | 固定 | 引線類型 | 無引線 |
允許偏差 | ±5(%) | 耐壓值 | 100(V) | 等效串聯(lián)電阻(ESR) | 0(mΩ) |
標稱容量 | 100pF~220uF(uF) | 損耗 | 0 | 額定電壓 | 6.3(V) |
絕緣電阻 | 0(mΩ) | 溫度系數(shù) | 0 |
華新科0603/1608 貼片電容 片容 貼片電容器設(shè)計
he amount of solder at the terminations has a direct effect on the reliability of the capacitor.
1) The greater the amount of solder, the higher the stress on the chip capacitor, and the more likely that
it will break. When designing a P.C. board, determine the shape and size of the solder pads to have
proper amount of solder on the terminations.
2) Avoid using common solder pads for multiple terminations and provide individual solder pads for
each terminations.
See the following table for recommended pad dimensions.
Reflow Soldering
Footprint dimensions in mm
SIZE A B C D E F G
Processing
remarks
Placement
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